去查网 logo

Application Encapsulation

中文翻译应用封装

同义词释义

    1)Application Encapsulation,应用封装2)Extern Application Wrapper,外部应用封装3)package effect,封装效应4)packaging stress,封装应力5)package thermal stress,封装热应力6)Non-stress packaging,无应力封装

用法例句

    Piezoresistive strain gauge array for packaging stress test;

    测试封装应力用压阻式应变计阵列

    Substrate strengthen design and O rings suspension package realize well effect non-stress packaging.

    衬底强化设计和O型圈悬浮封装的巧妙结合实现了无应力封装。

    Research of thermal stress and analysis of thermal characteristic for plastic ball grid array package

    PBGA封装热应力研究与热特性分析

    Thermal Stress Analysis and Optimization of SCSP Chip Package

    叠层CSP芯片封装热应力分析与优化

    Thermal Stress Analysis of Stacking Chip Scale Package under Power Load;

    功率载荷下叠层芯片尺寸封装热应力分析

    A Study on Thermal Stress and Invalidation for Chip Scale Package;

    芯片尺寸封装(CSP)的热应力及热失效分析研究

    Analysis on Thermal Stress and Thermal Reliability of BGA Packaging

    BGA封装的热应力分析及其热可靠性研究

    Study on Stress-Strain and Thermal Failure of Ball Grid Array Package

    球栅阵列封装的应力应变及热失效研究

    Research on the thermal stress and warpage of WLCSP device

    晶圆尺寸级封装器件的热应力及翘曲变形

    Research on MEMS Packaging by Induction Heating and Its Applications;

    基于感应加热的MEMS封装技术与应用研究

    A New Packaging Structure of Stress-Insensitive FBG Temperature Sensor

    新型应力不敏感FBG温度传感封装结构

    Application of Glass Sealed Technology in Aviation Thermocouple Production

    玻璃封装工艺在航空热电偶生产中的应用

    hot-sealing film bagged packing machine

    热封薄膜袋式包装机

    Analysis and Comparison of Thermal Stress and Hygrothermal Stress of Lead-free Flip Chip Solder Joint

    无铅倒装焊点的热应力与湿热应力分析

    Research on Encapsulation Technique of FBG Strain Sensor Under High Strain Working Condition

    高应力状态下FBG应变传感器的封装研究

    Thermal Analysis of LED Packages based on Heat Pipe Heat Sink

    基于热管散热的LED器件封装热分析

    The Analysis and Simulation of Temperature Field and Stress Field in an Oil Slurry Heat Exchanger;

    油浆蒸汽发生器热应力计算及密封性能研究

    Sealing Analysis under Cooling and Heating Cycle for Reactor Pressure Vessel in Nuclear Power Station;

    核电站反应堆压力容器冷热态密封分析

    Application of Hot-tapping and Plugging Technology to Emergency Repair of Heating Pipeline

    带压开孔封堵技术在热力管道抢修的应用

    Study on Size Effect of Induction Heatng and Characteristics of Induction Heatng Interconnection Technology for BGA Packaging

    电磁感应加热尺寸效应及其BGA封装互连新方法特征研究

全部查询工具

关于我们免责声明联系我们网站地图最近更新

免责说明:本站为非营利性网站,本站内容全部由《去查网》从互联网搜集编辑整理而成,版权归原作者所有,如有冒犯,请联系我们删除。

Copyright © 2020 - 2024 quchaw.com All rights reserved.浙ICP备20019715号