batch wafer retrieval

用法例句

The Development and Applications of Wafer Spin Rinse/Dryer in IC Production Line;

IC生产线晶圆片冲洗甩干设备的开发和应用

In garnets (pyrope-almandine) of these enclaves, exsolution lamellae of phlogopite were discovered for the first time.

在辽宁复县50号金伯利岩岩筒中,发现了罕见的榴辉岩包体,在该包体的主要组成矿物石榴石中发现了金云母出溶片晶。

Antiphase domains and exsolution lamellaes are the main micro-structures of omphacite in thehigh-pressure metamorphlc belt, eastern Central China.

反相畴及出溶片晶是华中东部高压变质带中绿辉石的主要超微结构，出港片晶的大小受扩散速率和时间的控制，而反相畴的大小可作为变质温度和年龄的标志。

9mm Ge single crystal piece ,And has used A,B,the C three kind of choice point plans,Result show that B plan can test electronic resistivity and nonuniformity of Ge single crystal piece with the few test points,It reflected the real performance and reliability of the material,And it simplified the experimental procedure.

9mm的半导体锗单晶圆片的电阻率进行测定,并采用了A、B、C等三种选点方案,结果表明:方案B用少量的测试点就能测定和计算出锗单晶的电阻率和不均匀性,它不仅反映出材料的真实性和保证其可靠性,而且简化了试验程序。

Mechanical Test Wafer- A silicon wafer used for testing purposes.

机械测试晶圆片-用于测试的晶圆片。

Process Test Wafer- A wafer that can be used for processes as well as area cleanliness.

加工测试晶圆片-用于区域清洁过程中的晶圆片。

Ingot- A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are cut.

晶锭-由多晶或单晶形成的圆柱体，晶圆片由此切割而成。

Virgin Test Wafer- A wafer that has not been used in manufacturing or other processes.

原始测试晶圆片-还没有用于生产或其他流程中的晶圆片。

Bonded Wafers- Two silicon wafers that have been bonded together by silicon dioxide, which acts as an insulating layer.

绑定晶圆片-两个晶圆片通过二氧化硅层结合到一起，作为绝缘层。

Haze - A mass concentration of surface imperfections, often giving a hazy appearance to the wafer.

雾度-晶圆片表面大量的缺陷，常常表现为晶圆片表面呈雾状。

Notch- An indent on the edge of a wafer used for orientation purposes.

凹槽-晶圆片边缘上用于晶向定位的小凹槽。

Bonding Interface- The area where the bonding of two wafers occurs.

绑定面-两个晶圆片结合的接触区。

Primary Orientation Flat- The longest flat found on the wafer.

主定位边-晶圆片上最长的定位边。

Slip- A defect pattern of small ridges found on the surface of the wafer.

划伤-晶圆片表面上的小皱造成的缺陷。

Mound- A raised defect on the surface of a wafer measuring more than0.25 mm.

堆垛-晶圆片表面超过0.25毫米的缺陷。

Pit- A non-removable imperfection found on the surface of a wafer.

深坑-一种晶圆片表面无法消除的缺陷。

Waviness- Widely spaced imperfections on the surface of a wafer.

波纹-晶圆片表面经常出现的缺陷。

Smudge- A defect or contamination found on the wafer caused by fingerprints.

污迹-晶圆片上指纹造成的缺陷或污染。

Flat- A section of the perimeter of a wafer that has been removed for wafer orientation purposes.

平边-晶圆片圆周上的一个小平面，作为晶向定位的依据。

Premium Wafer- A wafer that can be used for particle counting, measuring pattern resolution in the photolithography process, and metal contamination monitoring.

测试晶圆片-影印过程中用于颗粒计算、量溶解度和检测金属污染的晶圆片。

Premium Wafer - A wafer that can be used for particle counting, measuring pattern resolution in the photolithography process, and metal contamination monitoring.

测试晶圆片-影印过程中用于颗粒计算、测量溶解度和检测金属污染的晶圆片。

Fixed Quality Area( FQA)- The area that is most central on a wafer surface.

质量保证区(QA)-晶圆片表面中央的大部分。