component density
同义词释义
- 1)component density,组件密度2)high desity assembly,高密度装配高密度组件3)cryptographic components,密码组件4)key module,密钥组件5)gasket statements,密封组件6)Packing as,密封件组件
用法例句
This paper also studies several core technologies development and introduce a technology breakthrough methods including cylinder, gasket statements, starter, and friction pair of side bearing.
阐述了转子发动机研发过程中缸体、密封组件、摩擦副、点火系统等关键技术的突破方法与途经。
high desity assembly
高密度装配高密度组件
The Experiment Research on the Convective Heat Transfer of High-Density Assembly Microchannel;
高密度组装微通道对流换热实验研究
3D Stacking Packaging in SMT for High Density Packaging
满足高密度组装的SMT三维封装堆叠技术
Industry standard size,miniature,high density assembly.
按工业标准尺寸生产,小型化,组装密度高。
Synthesis and Self-assembly of Well-defined Polymer Brushes with High Grafting Density of Alternating Amphiphilic Side Chains;
高密度两亲性接枝聚合物刷的合成及其自组装
If PTSA (paratoluene sulphonic acid) is used as catalyst, films with fine structure will be obtained and its cohesive strength higher than its adhesive strength.
配以对甲苯磺酸树脂膜组织致密,内聚强度高于附着强度.
accurate rapid dense method
高速度高密度精密压铸法
The letter was contained in a bottle fast as a Kentish oyster.
那封信装在一只高度密封的瓶子里。
The high encryption pack has not been installed on this machine.
高度加密包还没有安装在该机器上。
Investigation of Improving HD-PCB Substrate Packaging Quality
改善PCB高密度基板封装质量的研究
High-density IC Packaging Based on Flexible Printed Circuit
基于挠性基板的高密度IC封装技术
Comparison of exploration effect for different devices of high-density electrical prospecting.
高密度电法不同装置的勘探效果对比
Studies on the High Density Cultivation of Dictyostelium Discoideum and the Expression of Recombinant Soluble Human Fas Ligand;
高密度培养盘基网柄菌及重组可溶性人Fas配体表达的研究
Jacket: Black low mid or high density polyethylene.
护套:黑色低密度或中密度或高密度聚乙烯。
Synthesis and Self-assembly of Well-defined Polymer Brushes with High Grafting Density of Hydrophobic Poly(ε-caprolactone) and Hydrophilic Poly(2-(dimethylamino)ethyl methacrylate) Side Chains
结构规整的高密度两亲性接枝聚合物刷的合成及其自组装研究
In relation to an integrated circuit;a term that indicates small element size and high packing density.
集成电路技术中的一种修饰术语,表示元件体积小而且封装密度高。
high-density high-conductivity charge
高密度高导热性炉料
high molecular weight high density polyethylene
高分子量高密度聚乙烯
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