evaporated bump
同义词释义
- 1)evaporated bump,蒸发的隆起焊盘2)raised pad,隆起焊盘3)gold bump,金隆起焊盘4)gang bonding bump,群焊用隆起焊盘5)solder pad,焊料隆起焊盘6)bump squash,隆起焊盘压扁
用法例句
bumped tape automated bonding
链式隆起焊盘带自动焊接
To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.
为了获得要求的凸起高度,锡膏在晶片焊盘过焊。
Its hump bumped as he took it up.
当他端起来的时候,隆起来的盘底凹了下去。
A defect in the magnetizable surface coating ( for example, on magnetic disc ) consisting of a raised or thick area.
在磁性表层上(如磁盘上)的缺陷,包括隆起的区域或厚的区域。
Effect of Solder Pad Size on Solder Joint Reliability upon Flip Chip PBGA Packages
焊盘尺寸对FC-PBGA焊点可靠性的影响
Components required to be mounted off the board are provided with lead forms at the board surface or other mechanical support to prevent lifting of solder land.
需要离开线路板安装的组件在线路板表面利用引脚形状或其它机械支撑来防止焊盘的翘起。
Multiple Omnipotent Clone Cd-rom Disks of Windows 2000
WIN2000“万能”多光盘克隆技术
Multiple Omnipotent Clone CD-Rom Disks of Windows 2000;
WIN2000"万能"多光盘克隆技术
Fair of the Welding New Machine and welding Equipment in the Chengdu
焊接新设备和焊接器材展览会在成都隆重举行
When human has contact to Touch pad, electric charge in the human body will be accumulated through the Touch pad.
当人体接触感应焊盘时,在人体里的电荷将被通过感应焊盘积累。
To solder(two pieces of metal)together using a hard solder with a high melting point.
硬焊用高熔点的硬质焊锡将(两块金属)焊在一起
Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint
P对Au/Ni/Cu焊盘与SnAgCu焊点焊接界面可靠性的影响
Indicates back or backing. Use in conjunction with a groove symbol.
指示底焊或封底焊。与沟符号一起使用。
"The closing price was half a dollar up!
“收盘跳起了半元!
Those with money had plates made of pewter.
有钱人使的是用焊锡做的盘子。
Stainless steel wire rods for welding
GB/T4241-1984焊接用不锈钢盘条
Automatic Weld Parameter Set-Up including Pnelmate screen display.
焊接参数自动设定,包括盘面屏幕显示
Study on the Disc Welding Technologic Test of Magneto Rotor
永磁电机转子圆盘焊接工艺试验研究
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