optical disk substrate materials

用法例句

Numerical simulation on soldered joints of QFP device with different substrate materials and thicknesses;

基板材料对QFP焊点应力应变影响的数值模拟

This paper provides transmission characteristics of coplanar waveguides(CPW) and choice of substrate materials at 1 THz based on theory of lossy transmission line,full-wave electromagnetic simulations and technology of least-squares curve-fitting.

通过对比分析,为在太赫兹频段下平面结构传输线基板材料选择提供参考。

The article had summarized mostly the manufacturing technology about PCB substrate material fitting for drilling of CO_2 laser.

本连载文章,以近一两年发表的日本专利为对象,研究、综述了日本PCB基板材料业在制造技术上的新发展。

In the paper, development stratagem of PCB substrate material of Matsushita Electric Works, Ltd.

文章介绍了松下电工PCB基板材料的发展战略,综述了R-1755V的诸多性能,R-1755V具有低热膨胀、高可靠性和良好加工性,应用于网络设备、测量仪器和汽车领域。

Recent variety,performance,application of Japanese new epoxy resin used in high performance PCB base material were reviewed.

文章对日本近年在高性能PCB基板材料用新型环氧树脂的品种、性能及应用进行了阐述。

Fabrication and performance of Si_3N_4/epoxy composite used for electronic substrate;

氮化硅/环氧复合电子基板材料制备及性能

Main materials of printed circuit board (PCB) substrate were macromolecule resins, which were typical viscoelatic materials.

电路板基板材料主要以高分子树脂为主，是典型的黏弹性材料。

Low transmission loss halogen-free PCB base material

低传输损失无卤PCB基板材料的发展(一)

Development of New Epoxy Resin for PCB Base Materials

PCB基板材料用新型环氧树脂发展综述

Transformation of Market and Progress of Product about PCB Substrate Material in Japan;

日本PCB基板材料业的市场转变与产品发展

Research Progress in Thermal Conductivity and Sintering Additives of AlN Packaging Material

AlN陶瓷基板材料热导率与烧结助剂的研究进展

Analysis of New Variety and Technology of Copper Clad Laminates Worldwide(6)--Base Material R-1755D for Automobile PCB from Matsushita Electric Works

世界覆铜板新产品新技术赏析(6)——松下电工汽车PCB用基板材料R-1755D

Durability of GFRP composites laminate with epoxy-organoclay nanocomposite matrix

纳米复合材料基GFRP板材耐久性研究

Fabrication of Nano-porous SiC-based Ceramics Using Template Method;

模板法制备SiC基陶瓷纳米孔结构材料

Preparation and Properties of Glass Ceramic Materials for LTCC

LTCC基板用玻璃陶瓷材料的制备及性能

A thin surface layer, as of finely grained wood, glued to a base of inferior material.

饰面薄板；镶板粘在低质材料的基部的薄表层，如有精细木纹的木板

Growth of AlGaN films with different Al fraction on AlN template

基于AlN基板的不同Al组分的AlGaN材料生长

Appraisal of Material Property and Strain Analysis on Cherokee Panel - CowlAir Chamber

切诺基前围空气室板应变分析与材料性能评价

Fabrication and Study of One-Dimension Functional Material Based on AAO Template;

基于AAO模板的一维纳米功能材料制备与研究

Design on Blankholding Force for High Strength Steel Based on Strain Hardening;

基于材料硬化的高强度钢板压边力设计方法

The Residual Stress Analysis of Tial-Based Alloy and Composite Sheet;

TiAl基合金及其复合材料薄板的残余应力分析

Inverse Identification of Materials Imployed in Sheet Metal Simulation Based on the Combination of the Finite Element Method (FEM) and the Genetic Algorithm (GA);

基于micro GA和有限元的薄板材料参数的反求

Study on Novel Carbon-based Composite Pantograph Slide for Electric Locomotive;

新型电力机车受电弓碳基复合材料滑板研究

Composite Laminate Theory Based Dynamic Pavement Response

基于复合材料层合板理论的路面动力响应研究