solder

用法例句

Determination of mercury in tin solder by microhydride generation-atomic absorption spectrometry;

微型氢化物发生-原子吸收光谱法测定锡焊料中汞

Besides,some problems that confront tin solder sector after China's WTO accession shall be properly dealt with.

本文阐述了锡市场形势,包括国内生产、锡的消费及后市预测,说明了加入WTO后对我国锡工业发展的影响,最后提出了锡焊料行业入世后需要适应的几个问题。

Digital photography and AutoCAD were used at the same time to calculate the spreading area of tin solder without the need of using other instrument.

采用数码摄影技术与AutoCAD软件结合,探讨一种无需专用仪器测量锡焊料铺展性试验试件铺展面积的方法。

Tin-lead solder in the manufacture of professional audio equipment.

用于制造专业音响设备的铅锡焊料。

Inventory of special ICS having tin-lead solder on/in leads/balls, used in specialist/professional equipment.

用于专业设备，含有铅锡焊料的积体电路。

Sn-Pb soldering used in Ground-based Aeronautical Communication Equipment Manufacturing.

用于地基航空通讯设备制造业的铅锡焊料。

Transducers used in professional loudspeaker systems, using tin-lead solder.

用于专业扬声器系统，含有铅锡焊料的变换器。

tin-lead 60-40 solder

锡铅60-40焊料

Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.

无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。

Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.

无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。

Casting tin-lead solders

GB/T8012-1987铸造锡铅焊料

Sterling aluminium solder

斯特林锡锌铝合金焊料

Soldering materials are our major products, especially in Lead Free Soldering Materials.

焊锡物料是我们的主要产品，特别是无铅焊锡物料。

High precision welding materials pure tin lead alloy products.

高级精密焊接纯锡铅合金材料制品。

Constitutive Description of Tin-Lead Solder 63Sn-37Pb under Multiaxial Loading;

多轴加载下焊锡钎料63Sn-37Pb的本构描述

Electronic Hanliao; Electronic help of welding materials production; Research and development of new electronic materials; Tin welding materials; Electronic components; Electronic marketing tools.

电子焊料；电子助焊材料生产；新型电子材料研制开发；锡焊材料；电子元器件；电子工具销售。

Tin-lead solders-Determination of tin content-Potassium iodate titrimetric method

GB/T10574.1-1989锡铅焊料化学分析方法碘酸钾滴定法测定锡量

Simultaneous Dissolution of Tin and Slive in Copper Solder and Determination by ICP-AES

同时溶解和ICP-AES同时测定铜基锡银焊料中的锡和银

Experimental Study on Cyclic Behavior of Eutectic Tin-Lead Solder under Multiaxial Loading;

多轴载荷下共晶锡铅焊料的循环性能实验研究

Mechanical Properties and Low Cycle Fatigue Life of Solder under Multiaxial Loading;

焊锡钎料的多轴力学性能与低周疲劳寿命研究

Corrosion Research of Different Lead Free Wave Solder Pot Materials;

无铅波峰焊不同锡炉材料溶蚀行为研究