woodflour filler
同义词释义
- 1)woodflour filler,木粉填料2)wood-flour phenolics,木粉填充酚醛塑料3)scharl boards,木板填料4)powder stuffing,粉体填料5)powder packing,磁粉填料6)Sawdust packing column,木粉填充柱
用法例句
Application situation and problems in powder stuffing used in plastic industry;
粉体填料在塑料中的应用现状及面临的问题
Process of Alkaline Slag Filler and Research on Its Application in Rubber
白泥粉体填料的制备及其在橡胶中的应用研究
Study on white and colored PVAc coatings based on anhydrite powders with different granularities
硬石膏粉体为填料制备白色及彩色涂料初探
Study on the Preparation and Propeties of the Degradable Films from PE Filled with Talcum and Bentonite;
两种无机粉体填充聚乙烯制备复合降解塑料的研究
Study on the Interfacial Adhesive Properties of Particulate-Filled Polymer Composites;
粉体填充型聚合物基复合材料界面粘结性能研究
Nanometer Al_2O_3 Reinforced Polyetheretherketone (PEEK) Composites and Their Properties;
纳米氧化铝粉体填充增强聚醚醚酮复合材料及其性能研究
Effect of diameters of filler to conductivities of rubber matrix composites
橡胶基导热复合材料中填充粉体粒径对导热性能的影响
Local Test Study of Vibroflotation on Hydraulic Backfilled Silty and Fine Sand without Additional Backfill Materials
无填料振冲法加固吹填粉细砂现场试验研究
The filler content in the powder is up to 30%.
粉中填充料的含量可达30%。
Research of Recycled Polypropylene and Polyethylene Modified and Filled by Wood Flour;
木粉填充改性PP和PE再生料的研究
Lipophilic Modification of Inorganic Filling Fly Ash Fiber Surface
无机填料粉煤灰纤维表面的亲油改性
Orthogonal Experimental Studies on Preparation of BMC Using Waste Printed Circuit Board Powder as Filler
废旧线路板粉料作为BMC填料的正交试验研究
The influence of filler on the properties of epoxy encapsulating materials
硅微粉填料对环氧灌封材料性能的影响
By analysing of IR spectrum absorption occurs on the surface of the powders and surface property of filler is changed.
红外光谱分析表明偶联剂在粉体表面产生了有效吸附,改变了填料的表面性质。
Effect of Ultrafine Full-Vulcanized Powder Rubber (UFPR) and UFPR/NANO-Sized Inorganic Filler Compound on Modification of Rigid Polyvinyl Chloride;
超细全硫化粉末橡胶及其纳米无机填料复合体系对硬质聚氯乙烯的改性研究
The Study on the Modification Organic Nano-Silica and the Structure, Property of Nanosilica-Sn-S-SBR;
纳米SiO_2粉体的原位有机化及其填充星形S-SBR胶料的结构与性能研究
Study on Properties of Uhmwpe-Based Composities Filled with Inorganic Superfine Powders and Cross-Linked by Peroxid;
超高分子量聚乙烯超细无机粉体填充、有机交联改性复合材料性能研究
Study On Paste Filling Using Fly Ash to Replace Few Cement
粉煤灰替代部分水泥的膏体充填技术
Study of Thermal Powdered Slag Used for Trench Backfill
热焖粉化钢渣作沟槽回填材料的应用研究
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